uwe-niedermayer

PD Dr.-Ing. Uwe Niedermayer

Dielectric Laser Acceleration

Contact

Date of birth: 12. Feb. 1985

Place of birth: Timisoara, Romania

Citizenship: German

Homepage: http://www.temf.tu-darmstadt.de/temf/mitarbeiter/un_details.de.jsp

Private homepage: http://www.uweniedermayer.de

Sept. 24, 2015 PhD defense, thesis “Determination of Beam Coupling Impedance in the Frequency Domain”

Oct. 2005 – Aug. 2011 Diploma (BSc + MSc) in Electrical Engineering at TU Darmstadt

July 2008 – May 2009 Student exchange with IIT Madras, Chennai, India

June 2004 Abitur (high school diploma), Peter-Paul-Rubens Gymnasium, Siegen

Oct. 1st – Dec. 1st 2018 Visiting Postdoctoral Scholar at Ginzton Laboratory at Stanford

(R. L. Byer group), Stanford, CA, USA

Aug. 1st – Sept. 12th 2017 Guest scientist at UCLA (J. B. Rosenzweig group), Los Angeles, CA, USA

Sept. 2016 – present Leading “Simulations and Beam Dynamics” group in ACHIP

Oct. 2015 – present Leading “Accelerator on a Chip” (ACHIP) sub-group at TU Darmstadt

Aug. 13 – 16, 2013 Guest scientist at CERN, Prevessin, France

Apr. 7 – May 5, 2013 Guest scientist at CERN, Geneva, Switzerland

Apr. 2013 – Apr. 2014 Associated member of the CERN personnel (cooperation associate)

Sept. 2011 – Jan. 2013 PhD scholarship by GSI, office and laboratory location at GSI

May 2010 – Aug. 2011 Student trainee at GSI, department: Beam Physics

Oct. 2009 – Apr. 2010 Student trainee at GSI, department: Synchrotron RF

Jun. 2009 – Oct. 2009 Internship at GSI Helmholtz Center for Heavy Ion Research

Aug. 2005 – Oct. 2005 Internship at H. Kleinknecht GmbH, Siegen, Germany (automatic control)

Aug. 2004 – July 2005 Alternative Civilian Service at INVEMA e.V., Kreuztal, Germany

(integration of handicapped children in regular schools)

- DPG Nachwuchspreis Beschleunigerphysik 2020 (5000€ awarded) Link

- Innovator of the year 2019 by WEKA publishing group for “Accelerator on a Chip” at TU Darmstadt Link

- U. Niedermayer „Vorrichtung und Verfahren zum Führen geladener Teilchen“, German Patent Application (2020) Link